Bga Solder
Surface finishes for PCBs fluctuate in reliability, shelf life, flatness, price, and assembly procedures. All finishes have their own benefits; however, the process, product, and / or final use determine which surface finish works best for use with a specific application. The designer, end-user or assembler needs to work with the PCB manufacturer to choose the correct finish for the product design.
Hot Air Solder Leveling (HASL)
Hot Air Solder Leveling, a 63/37 tin lead solder, has served as the industry standard since the start of the circuit board.. HASL is the favorite because “Nothing Solders like Solder.” In situations where you have no concern about lead, HASL proves cost effective as well as a reliable finish for the making of PCBs of standard technology. This finish does, however, further stress on high layer circuit boards, resulting in ineffective long-term use. The added stress, short shelf life, and uneven soldering height on thick SMT or BGA pads make HASL a bad choice for wire bonding or chip technology. New technologies, tighter design principles and environmental issues are starting to make HASL obsolete. There are many Lead-free alloys that can replace the 63/37 tin lead solder process to make the board ROHS or Lead Free.
Lead-Free Hot Air Solver Level (LF HASL) is the ROHS compliant version of HASL. It is applied in the same but it is a different composition of the Solder. To comply with Lead-Free, the lead is removed and replaced by Gold, Nickel or other metals depending on your PCB manufacturer – thus the thickness varies anywhere between 1 to 15 mm.
Immersion Silver
Immersion Silver is a very simple process. The silver replaces the copper during the immersion process. It is quickly gaining recognition as a lead-free surface finish because of its lower cost (Compared to ENIG), uniform thickness and the capability to withstand the lead-free assembly temperatures. Immersion silver has a shelf life of one year. Over the past year PBC facilities installed silver process lines more than any other type of finish. Immersion silver has a controlled thickness of five to twelve micro inches and remains cost efficient, compatible with the majority of assembly processes.
Electroless Nickel/Immersion Gold (ENIG)
In the past users recognized ENIG as the best flat (fine pitch) surface and lead-free choice in the world. This surface finish holds several advantages, including exceptional shelf life and long-term experience and/or knowledge of the product. Nickel thickness generally measures 75 micro inches, compared to three to five micros for gold. The surface finish also possesses some disadvantages, including a higher cost, two-part. In addition, in situations of an uncontrolled process you may see the quality issue known as “Black Pad.” Here at Sierra Circuits, after years of working with ENIG, we have eradicated the “Black Pad” problem. By carefully varying gold thickness, we have been able to figure out the ideal thickness for the gold to make sure that our customers never see Black Pads.
Immersion Tin
Tin immersion process, more popular in the past, offers a consistent flat surface about 20-40 micro inches thick. It solders well and remains cost efficient. However, the finished PCBs have a limited shelf life necessitating you use them within three to six months. PCB factories worldwide have this process in place. It is also perfect for Lead Free assembly.
Organic Solderability Preservatives (OSP)
Organic Solderability Preservatives began in the 1970s and provide a thickness so fine you almost can’t measure it. The first formulas offered a limited shelf life of three to six months and withstood only one or two heat cycles, but today the newest OSP formulas offer much more because of their construction for lead free assembly and provide shelf life 12 months as well as the ability to handle numerous heat cycles.
Electroless Nickel – Electroless Palladium – Immersion Gold (ENEPIG)
ENEPIG Is considered by many people call it – the “Universal” finish. Is a combination of three metals- nickel, palladium and gold. It is considered the best surface finish for Lead-Free assembly and wire bonding. Because of the combination of the three metals, it has the best galvanic resistance. The palladium separates the gold from the Nickel to prevent noise voltage and stop corrosion. Also, because of the falling price of Palladium, it has become very reasonably priced. Sierra Circuits is one of the leading PCB manufacturers to offer ENEPIG.
Amit Bahl
Director of Marketing and Sales for Sierra Circuits, Inc.
Amit is tasked with exploring and developing new markets for High Density Interconnect PCBs and Microelectronic substrates. Sierra Circuits, Inc. has primarily serviced the quick turn prototype market and is now actively developing the Medical, Military and Automotive markets. Prior to joining Sierra Circuits, Inc., Amit Bahl was a part of IBM’s Global Services team, where he worked on automating and optimizing business processes using the latest Information technologies. Amit Bahl received his B.S.C in computer science with a minor in marketing from UCLA.
https://www.protoexpress.com/index.jsp
http://www.multicircuits.com/pcb/tech/surface_finishes.html word count 740
BGA Soldering – Memory Swapping by Hand
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IR-PRO-SC Infrared BGA Rework Station SpitFireMods Upgraded Unit XBOX 360 PS3 $1,995.00 |
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SpitFireMods IR PRO SC Reball Reflow XBOX 360 Playstation 3 BGA Rework Station $1,995.00 |
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220V HONTON HT-R490 Hot Air & Infrared BGA Rework Station + solder stencils jig $1,575.00 |
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HONTON HT-R390 110V Hot Air & Infrared BGA Rework Station + solder stencils jig $1,450.00 |
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220V HONTON HT-R390 Hot Air & Infrared BGA Rework Station + solder stencils jig $1,410.00 |
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10X NEW AMD RADEON IGP 216-0674022 BGA chipset With Lead free Solder Balls $1,199.95 |
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BGA rework station, bga solder station,repair station ,HT-R390 rework station $780.00 |
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USED BIRD 5000 BGA REWORK REFLOW SOLDERING STATION FLUX STENCILS SOLDER BALLS $799.00 |
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BGA rework station IR6000 with CCD system,bga solder station,infrared station $680.00 |
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10X NEW NVIDIA G92-700-A2 BGA chipset With Lead free Solder Balls $859.99 |
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10X NEW AMD RADEON IGP 216-0752001 BGA chipset With Lead free Solder Balls $799.95 |
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BGA rework station, LY IR6000,solder ball, solder paste, infrared bga station $550.00 |
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10X NEW NVIDIA G94-706-B1 BGA chipset With Lead free Solder Balls $699.95 |
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5X NEW AMD RADEON IGP 216-0674022 BGA chipset With Lead free Solder Balls $599.95 |
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10X NEW NVIDIA N11P-GE1-W-A3 BGA chipset With Lead Free Solder Balls $550.00 |
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5X NEW NVIDIA G94-706-B1 BGA chipset With Lead free Solder Balls $379.95 |
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2011 BGA Full Kit 90mm Rework Station + 184pcs Stecnils For Laptop Chip Rework $375.99 |
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2011 Latest Laptop XBOX PS3 BGA 184pcs Template BGA Kit 90mm For Chip Reballing $375.99 |
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KF11Станция BGA +184шт. Трафареты для NV ATI XBOX PS3 DDR+Паяльные Инструменты $373.49 |
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Комплект BGA – KF11Станция + 184шт. 90×90мм трафаретов + Флюс + Шары BGA $373.49 |
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2011 BGA Full Kit 90mm Rework Station + 184pcs Stecnils For Laptop Chip Rework $372.99 |
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2011 Latest Laptop XBOX PS3 BGA 184pcs Template BGA Kit 90mm For Chip Reballing $372.99 |
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2011 BGA Full Kit 90mm Rework Station + 184pcs Stecnils For Laptop Chip Rework $369.99 |
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2011 Latest Laptop XBOX PS3 BGA 184pcs Template BGA Kit 90mm For Chip Reballing $369.99 |
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10X NEW AMD 216-0810005 BGA chipset With Lead free Solder Balls $369.95 |
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20 BGA AMTECH RMA-223-TPF solder flux paste leaded 100g $368.00 |
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Комплект BGA для XBOX PS3 2011 – KF11Станция + 184шт трафаретов + Инструменты $367.79 |
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Комплект BGA – KF11Станция + 184шт. 90×90мм трафаретов + Флюс + Шары BGA $367.79 |
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KF11Станция BGA +184шт. Трафареты для NV ATI XBOX PS3 DDR+Паяльные Инструменты $367.79 |
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Комплект BGA – KF11Станция + 184шт. 90×90мм трафаретов + Флюс + Шары BGA $367.69 |
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KF11Станция BGA +184шт. Трафареты для NV ATI XBOX PS3 DDR+Паяльные Инструменты $367.69 |
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Комплект BGA для XBOX PS3 2011 – KF11Станция + 184шт трафаретов + Инструменты $367.69 |
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91 BGA stencil +reballing station template+balls kits $303.05 |
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BGA Kit Laptop Chip Rework KF11 JIG + 170p Templates + Flux + Solder Ball + Tool $347.49 |
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BGA Kit Laptop Chip Rework KF11 JIG + 170p Templates + Flux + Solder Ball + Tool $345.69 |
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184pcs NV ATI XBOX PS3 DDR 80x80mm Stencil + Tools Laptop Chip Rework BGA Kit $336.49 |
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220 pcs BGA reballing station stencil template sz:90mm $251.75 |
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184pcs NV ATI XBOX PS3 DDR 80x80mm Stencil + Tools Laptop Chip Rework BGA Kit $320.09 |
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10pcs nVIDIA NF-G6150-N-A2 BGA North Bridge Chipset Lead free Solder Balls $312.00 |
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210 pcs BGA reballing station stencil template sz:90mm $246.05 |
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Chemtronics CircuitWorks CW8100 No Clean Flux Dispensing Pen, 9ml $6.99 The CircuitWorks® No Clean Flux Dispensing Pen meets all of the technicians needs for electronics rework and prototyping – repairing, cleaning, protecting, lubricating, bonding, and restoring electrical conductivity to circuit boards and components. Chisel Tip Marker Provides Exact Delivery of Flux to Surface. Features * Applies a patented noncorrosive, halide free, organic no-clean flux |
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Gold Kapton Tape Polyamide High Temp 1/2 (12mm) x 36yds $5.99 PREMIUM QUALITY, not to be compared with cheaper imported tapes. High temperature tape is widely used for masking during powder coating, wave soldering, circuit board production, or holding parts in place during hot air rework or repair of electronic components. Due to it’s semi-transparent shiny gold color is also has a myriad of hobby and craft uses. Commonly used in electronics repair, it is t… |
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NEW!! Updated Aoyue 968A+ SMD Digital Hot Air Rework Station, 3 in 1 station has Hot Air, a 70 Watt Soldering Iron and a built in smoke absorber – 500 Watt Heater – 5 nozzles – 10 Soldering Iron Tips- Spare Heating Elements -Vacuum Pickup Kit $159.00 The NEW 968A+ has the following new features: 70 watt soldering iron with smoke absorber, Digital Display for the Soldering Iron Temperature, Soldering Iron Holder, Vacuum Pickup Kit, 10 Soldering iron tips, Spare Heating Elements for the iron and the hot air gun, Digital Calibration and Adjustable sleep timer for the soldering iron. The Quality and features available on this unit are the best i… |
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NEW SMD BGA IC Desktop Automatic Smart Reflow Oven – 110V US Standard $569.99 This is an INFRARED IC HEATER (Cat No: WT-9630) that has a computer-aided automatical temperature-control system, It offers eight soldering temperature-control options. This heater satisfies the strict U.S. requirements for both led and led-free SMD, BGA soldering applications. It is very easy to operate, completing the whole soldering process automatically. Using infrared radiation and circulatin… |
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies $65.00 This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry’s need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors … |
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Reflow Soldering Processes $100.28 Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process eng… |
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Area Array Packaging Handbook: Manufacturing and Assembly $39.98 *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)… |